View MPX5050_1130399.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

Freescale Semiconductor Technical Data
MPX5050 Rev 9, 05/2007
Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
The MPX5050/MPXV5050G series piezoresistive transducer is a state-of-theart monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This patented, single element transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. Features * * * * * * 2.5% Maximum Error over 0 to 85C Ideally suited for Microprocessor or Microcontroller-Based Systems Temperature Compensated Over -40 to +125C Patented Silicon Shear Stress Strain Gauge Durable Epoxy Unibody Element Easy-to-Use Chip Carrier Option ORDERING INFORMATION
Device Type Options Case No. MPX Series Order No. Packing Options Device Marking 1 2 3 Trays Trays Trays MPXV5050G MPXV5050G MPXV5050G 4
MPX5050 MPXV5050G SERIES
INTEGRATED PRESSURE SENSOR 0 to 50 kPa (0 to 7.25 psi) 0.2 to 4.7 V Output SMALL OUTLINE PACKAGE SURFACE MOUNT
MPXV5050GP CASE 1369-01
MPXV5050DP CASE 1351-01
MPXV5050GC6U CASE 482A-01
SMALL OUTLINE PACKAGE PIN NUMBERS(1)
N/C VS Gnd Vout 5 6 7 8 N/C N/C N/C N/C
SMALL OUTLINE PACKAGE (MPXV5050G SERIES) Ported Element Side Port Dual Port Axial Port 1369 MPXV5050GP 1351 MPXV5050DP 482A MPXV5050GC6U 482A MPXV5050GC6T1 UNIBODY PACKAGE (MPX5050 SERIES) Basic Element Ported Element Differential Differential Dual Ports Gauge 867 MPX5050D -- -- -- MPX5050D MPX5050DP MPX5050GP
Tape & Reel MPXV5050G
1. Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead.
UNIBODY PACKAGE PIN NUMBERS(1)
1 2 3 Vout Gnd VS 4 5 6 N/C N/C N/C
867C MPX5050DP 867B MPX5050GP
1. Pins 4, 5, and 6 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead.
UNIBODY PACKAGES
MPX5050D CASE 867-08 MPX5050GP CASE 867B-04 MPX5050DP CASE 867C-05
(c) Freescale Semiconductor, Inc., 2007. All rights reserved.
VS
Sensing Element
Thin Film Temperature Compensation and Gain Stage #1
Gain Stage #2 and Ground Reference Shift Circuitry
Vout
GND
Pins 4, 5, and 6 are NO CONNECTS for Unibody Device Pins 1, 5, 6, 7, and 8 are NO CONNECTS for Small Outline Package Device
Figure 1. Fully Integrated Pressure Sensor Schematic Table 1. Maximum Ratings(1)
Rating Maximum Pressure (P1 > P2) Storage Temperature Operating Temperature Symbol Pmax Tstg TA Value 200 -40 to +125 -40 to +125 Unit kPa C C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
MPX5050 2 Sensors Freescale Semiconductor
Table 2. . Operating Characteristics (VS = 5.0 Vdc, TA = 25C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 4 required to meet electrical specifications.)
Characteristic Pressure Range(1) Supply Voltage(2) Supply Current Minimum Pressure Offset(3) @ VS = 5.0 Volts Full Scale Output(4) @ VS = 5.0 Volts Full Scale Span(5) @ VS = 5.0 Volts Accuracy(6) Sensitivity Response Time(7) Output Source Current at Full Scale Output Warm-Up Time(8) Offset Stability(9) 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. Accuracy (error budget) consists of the following: * Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. * Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. * Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure at 25C. * TcSpan: Output deviation over the temperature range of 0 to 85C, relative to 25C. * TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0 to 85C, relative to 25C. * Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS at 25C. 7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 9. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. (0 to 85C) Symbol POP VS Io Voff Min 0 4.75 -- 0.088 Typ -- 5.0 7.0 0.2 Max 50 5.25 10 0.313 Unit kPa Vdc mAdc Vdc
(0 to 85C)
VFSO
4.587
4.7
4.813
Vdc
(0 to 85C)
VFSS
--
4.5
--
Vdc
(0 to 85C)
-- V/P tR Io+ -- --
-- -- -- -- -- --
-- 90 1.0 0.1 20 0.5
2.5 -----------
%VFSS mV/kPa ms mAdc ms %VFSS
MPX5050 Sensors Freescale Semiconductor 3
Figure 3 illustrates the Differential/Gauge Sensing Chip in Table 3. Mechanical Characteristics
Characteristics Weight, Basic Element (Case 867) Weight, Basic Element (Case 1369) Weight, Basic Element (Case 482A) Typ 1.8 3.376 Unit grams grams grams
the basic chip carrier (Case 867). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The MPX5050/MPXV5050G series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application.
5.0 4.5 Transfer Function: Vout = VS*(0.018*P+0.04) ERROR 4.0 VS = 5.0 Vdc 3.5 TEMP = 0 to 85C 3.0 Output (V) 2.5 2.0 1.5 1.0 0.5 0 0 5 10 15 20 25 MAX
Figure 2 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0x to 85xC using the decoupling circuit shown in Figure 4. The output will saturate outside of the specified pressure range. Figure 4 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended.
TYPICAL
MIN
30
35
40
45
50
55
Differential Pressure (kPa)
Figure 2. Output versus Pressure Differential
Fluoro Silicone Gel Die Coat Die Wire Bond P1
Stainless Steel Metal Cover Epoxy Plastic Case
+5 V
Vout Vs IPS 1.0 F 0.01 F GND
OUTPUT
470 pF
Lead Frame
Differential/Gauge Element P2
Die Bond
Figure 3. Cross-Sectional Diagram (not to scale)
Figure 4. Recommended Power Supply Decoupling and Output Filtering (For additional output filtering, please refer to Application Note AN1646.)
MPX5050 4 Sensors Freescale Semiconductor
Transfer Function
Nominal Transfer Value: Vout = VS (P x 0.018 + 0.04)
(Pressure Error x Temp. Factor x 0.018 x VS) VS = 5.0 V 0.25 Vdc
Temperature Error Band
MPX5050/MPXV5050G SERIES
4.0 3.0 Temperature Error Factor 2.0 1.0 0.0 -40 -20 0 20 40 60 80 100 120 140 Temperature in C NOTE: The Temperature Multiplier is a linear response from 0 to -40C and from 85 to 125C. Temp -40 0 to 85 +125 Multiplier 3 1 3
Pressure Error Band
Error Limits for Pressure 3.0 2.0 Pressure Error (kPa) 1.0 0.0 -1.0 -2.0 -3.0 Pressure 0 to 50 (kPa) Error (Max) 1.25 (kPa) 0 10 20 30 40 50 60 Pressure (in kPa)
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluorosilicone gel which protects the die from harsh media. The MPX pressure
Part Number MPX5050D MPX5050DP MPX5050GP MPXV5050GP MPXV5050DP MPXV5050GC6U/T1
sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below:
Case Type 867 867C 867B 1369 1351 482A Pressure (P1) Side Identifier Stainless Steel Cap Side with Part Marking Side with Port Attached Side with Port Attached Side with Part Marking Vertical Port Attached
MPX5050 Sensors Freescale Semiconductor 5
PACKAGE DIMENSIONS
C R M B -AN
PIN 1 SEATING PLANE
1 2 3 4 5 6
POSITIVE PRESSURE (P1)
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630).
INCHES MILLIMETERS MAX MIN MAX MIN 16.00 0.595 0.630 15.11 13.56 0.514 0.534 13.06 5.59 0.200 0.220 5.08 0.84 0.027 0.033 0.68 1.63 0.048 0.064 1.22 0.100 BSC 2.54 BSC 0.40 0.014 0.016 0.36 18.42 0.695 0.725 17.65 30 NOM 30 NOM 12.57 0.475 0.495 12.07 11.43 0.430 0.450 10.92 0.090 0.105 2.29 2.66
L
-TG F D 6 PL 0.136 (0.005)
M
J S
TA
M
DIM A B C D F G J L M N R S OPEN GROUND +VOUT +VSUPPLY -VOUT OPEN
STYLE 1: PIN 1. 2. 3. 4. 5. 6.
VOUT GROUND VCC V1 V2 VEX
STYLE 2: PIN 1. 2. 3. 4. 5. 6.
OPEN GROUND -VOUT VSUPPLY +VOUT OPEN
STYLE 3: PIN 1. 2. 3. 4. 5. 6.
CASE 867-08 ISSUE N UNIBODY PACKAGE
P 0.25 (0.010) X R
PORT #1 POSITIVE PRESSURE (P1) PORT #2 VACUUM (P2)
M
TQ
M
-AU W L V
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH.
INCHES MIN MAX 1.145 1.175 0.685 0.715 0.405 0.435 0.027 0.033 0.048 0.064 0.100 BSC 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.159 0.063 0.083 0.220 0.240 0.910 BSC 0.182 0.194 0.310 0.330 0.248 0.278 MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 10.29 11.05 0.68 0.84 1.22 1.63 2.54 BSC 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 1.60 2.11 5.59 6.10 23.11 BSC 4.62 4.93 7.87 8.38 6.30 7.06
PORT #2 VACUUM (P2)
N
PORT #1 POSITIVE PRESSURE (P1)
-QB
PIN 1
1
2
3
4
5
6
K S
C
SEATING PLANE
DIM A B C D F G J K L N P Q R S U V W X
-T-
-TJ
SEATING PLANE
G F
D 6 PL 0.13 (0.005)
M
A
M
STYLE 1: PIN 1. 2. 3. 4. 5. 6.
VOUT GROUND VCC V1 V2 VEX
CASE 867C-05 ISSUE F UNIBODY PACKAGE
MPX5050 6 Sensors Freescale Semiconductor
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 867B-04 ISSUE G UNIBODY PACKAGE
MPX5050 Sensors Freescale Semiconductor 7
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 867B-04 ISSUE G UNIBODY PACKAGE
MPX5050 8 Sensors Freescale Semiconductor
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE
MPX5050 Sensors Freescale Semiconductor 9
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE
MPX5050 10 Sensors Freescale Semiconductor
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE
MPX5050 Sensors Freescale Semiconductor 11
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE
MPX5050 12 Sensors Freescale Semiconductor
PACKAGE DIMENSIONS
-A4 5
D
8 PL
0.25 (0.010)
M
TB
S
A
S
N
-BG
8 1
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0 7 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0 7 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17
S
W
V C H J K M
PIN 1 IDENTIFIER
-TSEATING PLANE
DIM A B C D G H J K M N S V W
CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE
MPX5050 Sensors Freescale Semiconductor 13
How to Reach Us:
Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 +1-800-521-6274 or +1-480-768-2130 www.freescale.com/support Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) www.freescale.com/support Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064 Japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong +800 2666 8080 support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-441-2447 or 303-675-2140 Fax: 303-675-2150 LDCForFreescaleSemiconductor@hibbertgroup.com
Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals", must be validated for each customer application by customer's technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. FreescaleTM and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. (c) Freescale Semiconductor, Inc. 2007. All rights reserved.
MPX5050 Rev 9 05/2007

▲Up To Search▲

Price & Availability of MPX5050

	To Download MPX5050 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .